LFP Texas Instruments Operational Amplifiers – Op Amps Op Amp datasheet, inventory, & pricing. LFP. The D packages are available taped and reeled. Add the suffix R to the device type (ie., LFDR). absolute maximum ratings over operating free-air. The LF can be used in applications such as high-speed integrators, .. Reproduction of TI information in TI data books or data sheets is permissible only if.

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LF353P Datasheet PDF – Texas Instruments

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It requires low supply current yet maintains a large gain-bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents. The LF can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits. Add the suffix R to the device type ie. Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.

Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Datzsheet techniques must be used that will maintain the junction temperatures as close to the ambient temperature as possible.

Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously. Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Device has been announced but is not in production.

Samples may or may not be available. TI has discontinued the production of the device. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.

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Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

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Lfp datasheet pdf

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